Designed by Bubble studio
Specifications
Gasket Mount 6063 Alu case
QMK/VIA Supported Hotswap PCB
PCB with USB-C daughterboard
PC Plate(flex cut design)
Brass/Alu weight
6° Typing Angle
Poron Dampening pads
PE Foam Pad Included
Editions:
Bubble75 Standard with Alu Weight
Bubble75 Premium with Brass Weight
Buy Add-ons HERE.
GB Time: Oct. 8th – Oct. 25th, 2021
Estimate Delivery Time: April, 2022 (the delivery time of vendor is estimated to be a little later)
Note: Refunds may not be available after submission of your Group Buy order to manufacturer. Any available refund will be deducted 4.4%+0.3 fee. The final product color may vary from the original photos but at an acceptable aspect. Please check more high resolution photos and videos here.